Items where Author is "Yamin, A.F.M. "

Proceeding Paper

Shaffiar, Norhashimah and Yamin, A.F.M. and Loh, W.K. and Tamin, M.N. (2012) Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5th-7th Dec 2012 , Singapore.

Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak.

Yamin, A.F.M. and Shaffiar, Norhashimah and Loh, W.K. and Tamin, M.N. (2011) Damage progression in BGA solder joints during board-level drop test. In: 13th Electronics Packaging Technology Conference (EPTC 2011), 7th - 9th December 2011 , Singapore.